David Lewis

Recovery Of Imageable Polyacetylenes From Binder Containing Aqueous Dispersions

Application

#5147787 Sep 15, 1992

Filed

Aug 5, 1988

Inventor

David F. Lewis (Monroe, CT) · Robert D. Schenfele (Caldwell, NJ)

Appl. No.

7/228426

Assignee

ISP Investments Inc. (Wilmington, DE)

International Classification

C12P 100, C07K 312, C12N 948, C12N 978

U.S. Classification

435 41

Abstract

This invention relates to a process for the recovery of a substantially insoluble, radiation imageable polyacetylene dispersion in aqueous binder which comprises contacting the dispersion with a proteolylic enzyme in an amount sufficient to decompose the binder, at a pH of from about 3 to about 9 and a temperature of between about 20. degree. C. and about 70. degree. C. and separating polyacetylene solids from the resulting liquid mixture, and which solids can be solubilized and recrystallized for further use.

Three Dimensional Package And Architecture For High Performance Computer

Application

#5817986 Oct 6, 1998

Filed

Aug 20, 1996

Inventor

Evan Ezra Davidson (Hopewell Junction, NY) · David Andrew Lewis (Carmel, NY) · Jane Margaret Shaw (Ridgefield, CT) · Alfred Viehbeck (Fishkill, NY) · Janusz Stanislaw Wilczynski (Ossining, NY)

Appl. No.

8/699954

Assignee

International Business Machines Corporation (Armonk, NY)

International Classification

H05K 100

U.S. Classification

174250

Abstract

A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly.

Protective Coatings For Polyacetylenic Recording Media

Application

#4985290 Jan 15, 1991

Filed

Feb 16, 1990

Inventor

David F. Lewis (Monroe, CT) · Robert D. Schenfele (Caldwell, NJ) · Thomas Winkler (Maywood, NJ)

Appl. No.

7/481036

Assignee

GAF Chemicals Corporation (Wayne, NJ)

International Classification

B32B 300

U.S. Classification

428 76

Abstract

The invention relates to a light stabilizing and antioxidant coating for polyacetylenic recording media which comprises an aqueous composition of ascorbic acid, gelatin and less than 2% by weight of surfactant wherein the mole ratio of acid to gelatin is between about 1:1 and about 10:1 dissolved in from about 35 wt. % to about 80 wt. % of water.

Golf Tee Stand With Ground Anchoring Mechanism And Non-Adjustable Base

Application

#5571055 Nov 5, 1996

Filed

Mar 14, 1995

Inventor

Timothy J. Lewis (Erie, PA) · David W. Lewis (Venango, PA)

Appl. No.

8/403293

Assignee

Timothy J. Lewis (Erie, PA) · David W. Lewis (Venango, PA)

International Classification

A63B 5700

U.S. Classification

473398

Abstract

Presented is a golf tee device having ground anchoring prongs to stabilize the tee upon impact with a club head and keep the tee from "popping" out of the ground and traveling haphazardly. Also, the tee incorporates a circular non-adjustable base feature that limits the depth to which the tee can be inserted into the ground, thereby adjusting the elevation of the golf tee, and thus providing a platform for the golf ball that is the proper elevation to meet the needs of a particular golfer. Further, the base feature also aligns the tee in a perpendicular position relative to the ground. Incorporation of spine supporting radii above and below the base feature serve to significantly increase the strength and resiliency of the device.

Asynchronous Channel Error Mechanism

Application

#4381540 Apr 26, 1983

Filed

Jun 30, 1980

Inventor

David O. Lewis (Rochester, MN) · John W. Reed (Pine Island, MN)

Appl. No.

6/164161

Assignee

International Business Machines Corporation (Armonk, NY)

International Classification

G06F 1134

U.S. Classification

364200

Abstract

An apparatus is provided for assembling information concerning the occurrence of a channel error to form a channel error event consisting of four fields: a channel function field; a field identifying the I/O register in use at the occurrence of the channel error; a field identifying the particular I/O adapter using the channel when the error occurred; and a field specifying the type of channel error. The four-field channel error event is placed in an I/O event stack accessible to the CPU, and the CPU is notified of the addition to the I/O event stack. If the attempt to store the channel error event on the I/O event stack fails, the channel is stopped until the CPU signals the channel to restart and to again attempt to log the channel error event on the I/O event stack.

Microwave Annealing

Application

#6051283 Apr 18, 2000

Filed

Jan 13, 1998

Inventor

Kam Leung Lee (Putnam Valley, NY) · David Andrew Lewis (Carmel, NY) · Ronnen Andrew Roy (Ossining, NY) · Raman Gobichettipalayam Viswanathan (Briarcliff Manor, NY)

Appl. No.

9/005729

Assignee

International Business Machines Corp. (Armonk, NY)

International Classification

B05D 306, B05D 300, H01L 2144

U.S. Classification

427553

Abstract

The present invention is directed to a method of forming a new material layer or region near an interface region of two dissimilar materials, and an optional third layer, wherein at least one of said dissimilar materials or optional third is capable of being heated by microwave energy. The method of the present invention includes a step of irradiating a structure containing at least two dissimilar materials and an optional third layer under conditions effective to form the new material layer in the structure. An apparatus for conducting the microwave heating as well as the structures formed from the method are also described herein.