Holger Klein

Fast Calibration And Programming Optical Components

Application

#2016025 Sep 1, 2016

Filed

Oct 30, 2015

Inventor

Holger Klein (Englewood Cliffs, NJ) · Chad Althouse (Englewood Cliffs, NJ) · Todd Chicci (Englewood Cliffs, NJ) · Patrick Bybee (Englewood Cliffs, NJ) · Henrik Poulsen (Englewood Cliffs, NJ) · Sarat Chandra Gundavarapu (Englewood Cliffs, NJ)

Appl. No.

14/928998

Assignee

Holger Klein (Englewood Cliffs, NJ) · Chad Althouse (Englewood Cliffs, NJ) · Todd Chicci (Englewood Cliffs, NJ) · Patrick Bybee (Englewood Cliffs, NJ) · Henrik Poulsen (Englewood Cliffs, NJ) · Sarat Chandra Gundavarapu (Englewood Cliffs, NJ)

International Classification

H01S 5/042, H01S 5/125, H01S 5/00

Abstract

A method and apparatus for calibrating and controlling tunable lasers are disclosed. Multiple methodologies disclosed herein may be used, alone or in combination, which significantly speed up a calibration time and thus provide a significant advantage over existing technology in calibrating the tunable lasers. Certain methodologies benefit from a unique design of the tunable lasers that couple two or more optical facets to an output. The tunable lasers may be equipped with two or more sampled grating distributed Bragg reflector (SGDBR) mirrors and may include Semiconductor Optical Amplifiers (SOAs) after the SGDBR mirrors.

Optical Fiber Alignment Device

Application

#2018031 Nov 1, 2018

Filed

Jun 20, 2018

Inventor

Daniel J. Blumenthal (Santa Barbara, CA) · Ari Novack (New York, NY) · Holger N. Klein (Santa Barbara, CA)

Appl. No.

16/013666

Assignee

Daniel J. Blumenthal (Santa Barbara, CA) · Ari Novack (New York, NY) · Holger N. Klein (Santa Barbara, CA)

International Classification

G02B 6/42, G02B 6/30

Abstract

A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Method And Apparatus For Controlling, Monitoring, And Communicating With Tunable Optical Devices And Subassemblies

Application

#2016025 Sep 1, 2016

Filed

Nov 20, 2015

Inventor

Holger Klein (Englewood Cliffs, NJ) · Todd Cicchi (Englewood Cliffs, NJ) · Patrick Bybee (Englewood Cliffs, NJ) · Henrik Poulsen (Englewood Cliffs, NJ)

Appl. No.

14/947905

Assignee

Holger Klein (Englewood Cliffs, NJ) · Todd Cicchi (Englewood Cliffs, NJ) · Patrick Bybee (Englewood Cliffs, NJ) · Henrik Poulsen (Englewood Cliffs, NJ)

International Classification

H04B 10/50

Abstract

An apparatus for controlling, monitoring, and communicating with an optical device, photonic integrated circuit or subassembly is provided. The apparatus includes an optical device or subassembly; and afield programmable device including programmable hardware gates coupled to the optical device or subassembly. The field programmable device may be configured to implement a plurality of functions at a gate level for controlling, monitoring, and/or communicating with the optical device or subassembly, each of the plurality of functions being configured to execute as a concurrent process, without use of a microprocessor or a microcontroller. Further, a programmable optical device, such as a programmable optical transmitter, optical subassembly, or transceiver based on a tunable laser having field programmable device centric control systems with software-enabled features offer extensive real-time control and monitoring functionality based on for example actual traffic flows.

Optically Aligned Hybrid Semiconductor Device And Method

Application

#2018005 Feb 22, 2018

Filed

Oct 13, 2017

Inventor

Ari Jason Novack (New York, CA) · Holger N. Klein (Santa Barbara, CA) · Nathan A. Nuttall (Castaic, CA) · Kishor V. Desai (Fremont, CA) · Daniel J. Blumenthal (Santa Barbara, CA) · Michael J. Hochberg (New York, NY) · Ruizhi Shi (New York, NY)

Appl. No.

15/783263

Assignee

Ari Jason Novack (New York, CA) · Holger N. Klein (Santa Barbara, CA) · Nathan A. Nuttall (Castaic, CA) · Kishor V. Desai (Fremont, CA) · Daniel J. Blumenthal (Santa Barbara, CA) · Michael J. Hochberg (New York, NY) · Ruizhi Shi (New York, NY)

International Classification

G02B 6/42, H01L 31/18, H01L 31/12, G02B 6/13, G02B 6/136, H01L 25/00, H01L 25/16, G02B 6/12

Abstract

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Optically Aligned Hybrid Semiconductor Device And Method

Application

#2016029 Oct 6, 2016

Filed

Mar 31, 2016

Inventor

Ari Jason Novack (New York, CA) · Holger N. Klein (Santa Barbara, CA) · Nathan A. Nuttall (Castaic, CA) · Kishor V. Desai (Fremont, CA) · Daniel J. Blumenthal (Santa Barbara, CA) · Michael J. Hochberg (New York, NY) · Ruizhi Shi (New York, NY)

Appl. No.

15/087278

Assignee

Ari Jason Novack (New York, CA) · Holger N. Klein (Santa Barbara, CA) · Nathan A. Nuttall (Castaic, CA) · Kishor V. Desai (Fremont, CA) · Daniel J. Blumenthal (Santa Barbara, CA) · Michael J. Hochberg (New York, NY) · Ruizhi Shi (New York, NY)

International Classification

G02B 6/42, G02B 6/136, G02B 6/13, H01L 31/12, H01L 31/18

Abstract

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Optical Fiber Alignment Device

Application

#2017020 Jul 20, 2017

Filed

Mar 23, 2017

Inventor

Daniel J. Blumenthal (Santa Barbara, CA) · Ari Novack (New York, NY) · Holger N. Klein (Santa Barbara, CA)

Appl. No.

15/467061

Assignee

Daniel J. Blumenthal (Santa Barbara, CA) · Ari Novack (New York, NY) · Holger N. Klein (Santa Barbara, CA)

International Classification

G02B 6/42

Abstract

A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.