• Biography
    Yi-Shao Lai received the Ph.D. degree in engineering mechanics from The University of Texas at Austin in 2002, and M.S and B.S. degrees in civil engineering from National Central University, Jhongli, Taiwan. He is currently pursuing an M.S. degree...
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  • Professional Experience
    2010 - Present
    Impact Factor: 0.781
    2008 - Present
    Offering two classes: "Introduction to IC Packaging" and "Reliability and Analysis of Electronic Packages".
    2008 - Present
    Impact Factor: 1.117 Co-edited 5 special issues: - Low Temperature Processing for Microelectronics and Microsystems Packaging, TBD, with Tadatomo Suga & Jenn-Ming Song - High-Power LED Packaging and Assembly, TBD, with Cheng-Yi Liu, Shi-Wei Ricky Lee & Moo Whan Shin - Copper Wire Bonding, 51(1), 2011, with Michael Mayer - Advances in Wafer Level Packaging (WLP), 50(4), 2010, with Tong Yan Tee & Xuejun Fan - Recent Research Advances in Pb-free Solders, 49(3), 2009, with Ho-Ming Tong & King-Ning Tu
    2006 - Present
    2002 - Present
    Leading electronic & photonic packaging technologies R&D in - Strategic planning - Manufacturing technology innovations - Substrate technologies - Thermal issues - Reliability issues - Material characterizations - Advanced computations for electronic & photonic materials
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  • Educational Background
    2008 - 2012

    Research topic: Performance evaluation of laboratory services following the concept of balanced scorecard

    1997 - 2002

    Dissertation: A Study of Three-Dimensional Cracks Advisor: Dr. Gregory J. Rodin

    1993 - 1995

    Thesis: Micromechanical Analysis of Layered Media Advisor: Dr. Chung-Yue Wang

    1989 - 1993

    Report: Applications of Fractals to Hydrological Research Advisor: Dr. Ray-Shyan Wu Received College Student Research Award in 1993 from National Science Council, Taiwan

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  • Professional Skills
    Solid mechanics, Computational mechanics, Fracture mechanics, Stress analysis and measurements of electronic packages, Board-level reliability of electronic packages, Electromigration & thermomigration experiments and simulations, Nanomechanical characterizations
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  • Milestones

    IEEE Senior Member (2007), Outstanding Young Engineer (CIE, 2008 & CSME, 2007)

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