- Yi-Shao Lai received the Ph.D. degree in engineering mechanics from The University of Texas at Austin in 2002, and M.S and B.S. degrees in civil engineering from National Central University, Jhongli, Taiwan. He is currently pursuing an M.S. degree...Read More
- 10/2010 - PresentImpact Factor: 0.78101/2010 - PresentImpact Factor: 0.94408/2008 - PresentOffering two classes: "Introduction to IC Packaging" and "Reliability and Analysis of Electronic Packages".02/2008 - PresentImpact Factor: 1.117 Co-edited 5 special issues: - Low Temperature Processing for Microelectronics and Microsystems Packaging, TBD, with Tadatomo Suga & Jenn-Ming Song - High-Power LED Packaging and Assembly, TBD, with Cheng-Yi Liu, Shi-Wei Ricky Lee & Moo Whan Shin - Copper Wire Bonding, 51(1), 2011, with Michael Mayer - Advances in Wafer Level Packaging (WLP), 50(4), 2010, with Tong Yan Tee & Xuejun Fan - Recent Research Advances in Pb-free Solders, 49(3), 2009, with Ho-Ming Tong & King-Ning Tu02/2006 - Present01/2006 - Present09/2002 - Present09/2002 - PresentLeading electronic & photonic packaging technologies R&D in - Strategic planning - Manufacturing technology innovations - Substrate technologies - Thermal issues - Reliability issues - Material characterizations - Advanced computations for electronic & photonic materialsShow All Professional Experiences (5)
- 2008 - 2012
Research topic: Performance evaluation of laboratory services following the concept of balanced scorecard1997 - 2002
Dissertation: A Study of Three-Dimensional Cracks Advisor: Dr. Gregory J. Rodin1997 - 20021993 - 1995
Thesis: Micromechanical Analysis of Layered Media Advisor: Dr. Chung-Yue Wang1989 - 1993
Report: Applications of Fractals to Hydrological Research Advisor: Dr. Ray-Shyan Wu Received College Student Research Award in 1993 from National Science Council, TaiwanShow All Educational Background (2)
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IEEE Senior Member (2007), Outstanding Young Engineer (CIE, 2008 & CSME, 2007)
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